香港理工大学容锦泉教授学术报告会
(常州校区第七届学术论坛暨办学30年系列学术报告会之一)
报告1:“3D打印金属构件内部结构的激光抛光技术”
时间:上午9:30~11:30, 2016年9月7号(周三)
地点:河海大学常州校区英才楼机电工程学院A301会议室
报告2:“香港的大学教育和人才培养”
时间:下午15:30~17:30, 2016年9月7号(周三)
地点:河海大学常州校区厚德楼M209
主办单位:河海大学机电工程学院
报告人:容锦泉教授(香港理工大学工程学院工业与系统工程系)
报告1内容简介:
金属抛光可以使工件表面更加光滑和明亮。常用的抛光工艺包括机械抛光、超声波抛光、离子束抛光和化学抛光等。激光抛光是一种新型的非接触式金属表面处理工艺,可以克服机械和电化学抛光存在的缺点。然而,对于激光抛光技术目前仍有四大技术难题亟待解决:(1) 如今3D打印金属材料主要应用于注塑模具和机械工具。而对于其他应用,如珠宝和牙科,并没有考虑使用不同的金属合金粉末对3D打印金属产品表面粗糙度的影响;(2) 在金属制品的激光抛光过程中,尚未开发一种有效的氧化预防控制机制;(3) 对于具有内部结构的3D打印金属產品,尚未研究有效的激光抛光工艺方法; (4) 尚未对3D打印金属产品在激光抛光工艺前后的化学成分特征变化进行清晰表征。本报告将针对以上难题介绍一种新型的激光抛光技术,能够实现对3D打印出来的金属制品的内部结构进行有效的抛光。
容锦泉教授中文简介:
欢迎各位老师及学生参加!
Brief Biosketch of Prof. Winco K.C. Yung
Professor Winco K.C. Yung has over 31 years of experience in both academia and industry with engineering and management responsibilities. He is currently a Professor in the Industrial and Systems Engineering (ISE) Department at The Hong Kong Polytechnic University.
Professor Yung currently holds and has held various positions in public office, including Appointed Member of the Assessment Panel for the Enterprise Support Scheme under Innovation and Technology Commission (ITC) of HKSAR, Appointed Member of the Assessment Panel for the SERAP under Innovation and Technology Commission (ITC) of HKSAR, Member of the Stakeholders’ Group of HKQAA, the Founding Director of Hong Kong Electronics Packaging and Manufacturing Services Association (HKEPMSA), Honorary Advisor of The Hong Kong Printed Circuit Association (HKPCA), Council member of HKIE, Appointed Member of Qualification & Membership Board, Chairman of MI Discipline Advisory Panel of HKIE, Past Chairman of MIE Division of HKIE, External Assessor of Environment and Conservation Fund of The Hong Kong SAR Government, Appointed member of the Technology Review Panel of Information and Communication Technology R&D Centre of ASTRI, Invited Member of Admission Panel of the Technology Business Incubation Programme of Hong Kong Science and Technology Parks (HKSTP), and Invited Honorary Advisor of Institute of Supply Management, Pearl River Delta (ISM, PRD). He is an elected Fellow of HKIE.
Professor Yung’s research interests are in the areas of functional and electronic materials, electronic assembly, PCB fabrication technologies, product eco-design and green manufacturing, industrial environmental issues and regulations like EuP/WEEE/RoHS/REACH, technology management, quality & reliability. He has published over 220 articles in past years. He holds 8 patents granted and/or filed in USA, which have been/are to be licensed to relevant industries. He has been successful in dissemination, transfer and research of 52 projects (45 projects as PI), 22 of which are Government funded projects in collaboration with local PCB and electronic and electrical appliance industries with funding of HK$ 52.8 Million. He is currently the editor and editorial board member of a number of Journals worldwide.
Professor Yung is the founder and Centre-in-Charge of The Printed Circuit Board Technology Center (PCBTC) in ISE, which is funded by The HKSAR Government in 1998. PCBTC is now the hub to forecast, assess, disseminate and transfer appropriate hi-end technologies for PCB and electronics industry locally and in Pearl River Delta (PRD) Region. These activities are enabled through research and development work, seminars and workshops, contract research, industrial partners technology mapping, collaboration and negotiation with the Government and research institutions. As an illustrative example, PCBTC is the pioneer to introduce advanced laser technology in microvia fabrication to PCB and substrate industries in Hong Kong and nearby regions.
Professor Yung has delivered many talks publicly on product ecodesign and green manufacturing, environmental legislations like EuP, RoHS, WEEE, REACH, and related environmental issues in various media, seminars, forums, conferences and workshops, addressing to various industries in the past years. He was invited by the Hong Kong Trade Development Council (HKTDC) to represent Hong Kong’s electronic industry to speak at world renowned international trade fair “Electronica 2006” in Munich Germany in November 2006. He is the co-author of The Green Manufacturing Book Series: “RoHS & WEEE—Status compliance issues and implications” that was published in October 2006.